




Thermal Grizzly Minus Pad High Compression Thermal Pad 2pcs - 120x100x3mm
MINUS PAD High Compression
The thermal pads of the TG Minus Pad High Compression series feature exceptionally high compressibility. This makes them especially versatile in practical use, as a single pad can bridge varying height differences simultaneously. This is particularly useful when modifying graphics cards with a GPU water cooler or when replacing the thermal pads of a GPU cooler. A TG Minus Pad High Compression (HC Pad) can be applied to different components—such as VRAM, voltage regulators, and other contact surfaces—within the same setup.
Versatility and Application
High Compression pads are ideal in situations where the exact required thickness of thermal pads is unknown. In such cases, the thickness of the existing pads is measured and replaced with slightly thicker High Compression pads. These pads not only maintain their thermal conductivity under high compression, but the thermal conductivity can even increase with higher contact pressure.
Properties
Very high compressibility
Excellent thermal conductivity, even under heavy compression
Adapts well to height tolerances
Electrically non-conductive
Highly versatile in application
Easy to handle
Original: $26.29
-65%$26.29
$9.20Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MINUS PAD High Compression
The thermal pads of the TG Minus Pad High Compression series feature exceptionally high compressibility. This makes them especially versatile in practical use, as a single pad can bridge varying height differences simultaneously. This is particularly useful when modifying graphics cards with a GPU water cooler or when replacing the thermal pads of a GPU cooler. A TG Minus Pad High Compression (HC Pad) can be applied to different components—such as VRAM, voltage regulators, and other contact surfaces—within the same setup.
Versatility and Application
High Compression pads are ideal in situations where the exact required thickness of thermal pads is unknown. In such cases, the thickness of the existing pads is measured and replaced with slightly thicker High Compression pads. These pads not only maintain their thermal conductivity under high compression, but the thermal conductivity can even increase with higher contact pressure.
Properties
Very high compressibility
Excellent thermal conductivity, even under heavy compression
Adapts well to height tolerances
Electrically non-conductive
Highly versatile in application
Easy to handle























